Multi-Hole Process Plate Modification for Chip on Lead Device at Die Attach Process

The paper focused on the improvement done in chip on lead (COL) leadframe package assembly manufacturing to address the leadframe bouncing effect during die attach process. A new and enhanced process plate is designed with multi-hole configuration to provide a strong vacuum underneath the leadframe and to maintain the planarity during dispensing and die bonding of silicon dies onto the leadframe. With the new multi-hole process plate, leadframe bouncing was successfully eliminated during die attach process. For future works, the multi-hole process plate could be used on devices with similar configuration.